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Proceedings Paper

Applications of laser scanning systems to deposited dielectrics
Author(s): C. Thomas Larson
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Paper Abstract

Monitoring process equipment cleanliness with the aid of silicon test wafers and laser scanning detection systems is a highly effective method of process control. These systems detect and locate defects on a substrate with high sensitivity and precision. As integrated circuit manufacturers gain control over environmental contributions to contamination a move toward monitoring the contribution of defects by the process itself is gaining momentum. The additional complexity added to the measurement by the presence of a deposited film, however, requires that users acquire a better understanding of how a laser scanning system generally responds to each of the materials measured. Along with this understanding comes a much wider range of tools available to the user for controlling and understanding the process. With this push to isolate defects contributed by the process has come some interesting applications. Haze, for example, is generally regarded as a measure of the surface roughness. However, in the presence of a dielectric the haze measurement is directly related to the local film reflectivity. This paper discusses the application of two different types of laser scanning systems to the measurement of defects and haze on blanket dielectric films. Included is a brief discussion of the light scattering process in the presence of such films to aid the users of these systems in understanding the measurements they are making. Data from measurements on photoresist and other dielectrics illustrate the effect of the film on the scattering process and a discussion of how to optimize the measurement parameters in this context is included.

Paper Details

Date Published: 19 September 1995
PDF: 6 pages
Proc. SPIE 2637, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing, (19 September 1995); doi: 10.1117/12.221324
Show Author Affiliations
C. Thomas Larson, Tencor Instruments (United States)


Published in SPIE Proceedings Vol. 2637:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing
Anant G. Sabnis; Ivo J. Raaijmakers, Editor(s)

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