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Proceedings Paper

Laser applications in advanced chip packaging
Author(s): Dirk Müller; Andrew Held; Rainer Pätzel; Dave Clark; Joris van Nunen
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Paper Abstract

While applications such as drilling μ-vias and laser direct imaging have been well established in the electronics industry, the mobile device industry’s push for miniaturization is generating new demands for packaging technologies that allow for further reduction in feature size while reducing manufacturing cost. CO lasers have recently become available and their shorter wavelength allows for a smaller focus and drilling hole diameters down to 25μm whilst keeping the cost similar to CO2 lasers. Similarly, nanosecond UV lasers have gained significantly in power, become more reliable and lower in cost. On a separate front, the cost of ownership reduction for Excimer lasers has made this class of lasers attractive for structuring redistribution layers of IC substrates with feature sizes down to 2μm. Improvements in reliability and lower up-front cost for picosecond lasers is enabling applications that previously were only cost effective with mechanical means or long-pulsed lasers. We can now span the gamut from 100μm to 2μm for via drilling and can cost effectively structure redistribution layers with lasers instead of UV lamps or singulate packages with picosecond lasers.

Paper Details

Date Published: 14 March 2016
PDF: 5 pages
Proc. SPIE 9735, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI, 973508 (14 March 2016); doi: 10.1117/12.2213180
Show Author Affiliations
Dirk Müller, Coherent, Inc. (United States)
Andrew Held, Coherent, Inc. (United States)
Rainer Pätzel, Coherent LaserSystems GmbH & Co. KG (Germany)
Dave Clark, Coherent, Inc. (United States)
Joris van Nunen, Coherent Kaiserslautern GmbH (Germany)


Published in SPIE Proceedings Vol. 9735:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI
Beat Neuenschwander; Stephan Roth; Costas P. Grigoropoulos; Tetsuya Makimura, Editor(s)

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