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Proceedings Paper

Sensing technologies for semiconductor process applications
Author(s): Armando Iturralde
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Paper Abstract

As semiconductor manufacturing technology advances, there exists a need to review improvements in process monitoring and control. Some of these improvements may be possible by investigating and integrating advanced process sensors. Sensors typically provide information to equipment controllers for proper machine operation. Expanding this definition, a sensor could deliver quality information about the semiconductor product being manufactured. Sensors can provide effective manufacturing line operation, reduced cycle times, and improved product quality. Implementing advanced sensors can also reduce process variability, increase process stability, and provide many other benefits applicable to modern semiconductor production operation. In this paper, a review of the current literature on semiconductor process sensor technology is presented. Much of the literature discusses in-situ measurements for film thickness, particles, and/or other conditions which could affect the quality of the product. Instruments such as RGAs (Residual Gas Analyzers), in-situ film thickness monitors represent current and future advanced sensors. Prior to implementing sensors, it would be ideal to reduce the number of process measurements as much as possible to insure sensor effectiveness. It will be ideal to have working cost of ownership model in place to baseline operations and monitor improvements as sensors move into the production line. There are many new sensors available with highly improved performance, accuracy, and even built-in electronics. These sensors can replace or supplement existing equipment sensors to improve performance, reliability, and extend equipment life. With the increasing costs of maintaining capital equipment, successful implementation could mean substantial savings. These and many other implementation issues are also presented.

Paper Details

Date Published: 19 September 1995
PDF: 11 pages
Proc. SPIE 2637, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing, (19 September 1995); doi: 10.1117/12.221305
Show Author Affiliations
Armando Iturralde, Sony Electronics, Inc. (United States)

Published in SPIE Proceedings Vol. 2637:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing
Anant G. Sabnis; Ivo J. Raaijmakers, Editor(s)

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