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Proceedings Paper

In-situ particle monitoring: today's technology drivers
Author(s): Peter Borden; Martin Elzingre; Derek Aqui
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Paper Abstract

In situ particle monitors (ISPMs) have seen rapidly increased acceptance in semiconductor production because they provide automated, 100% inspection of particle levels during process at a low cost per inspection point. As productivity enhancement tools, ISPM use is only justified when it increases productivity of the host tool. The sensors provide an indirect measure of wafer contamination, and are of greatest value when they provide a particle count that correlates to yield and has identifiable causes. Manufacturing integration has now become the key factor driving the future of ISPM technology. This paper will discuss some of these factors, including correlation, sensor placement, impact on sensor design, application of expertise to qualification and maintenance, and gauge capability.

Paper Details

Date Published: 19 September 1995
PDF: 5 pages
Proc. SPIE 2637, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing, (19 September 1995); doi: 10.1117/12.221302
Show Author Affiliations
Peter Borden, High Yield Technology (United States)
Martin Elzingre, High Yield Technology (United States)
Derek Aqui, High Yield Technology (United States)


Published in SPIE Proceedings Vol. 2637:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing
Anant G. Sabnis; Ivo J. Raaijmakers, Editor(s)

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