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Proceedings Paper

MEMS infrastructure: the multiuser MEMS processes (MUMPs)
Author(s): Karen W. Markus; David A. Koester; Allen Cowen; Ramu Mahadevan; Vijayakumar R. Dhuler; D. Roberson; L. Smith
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Paper Abstract

In order to help provide access to advanced MEMS technologies, and lower the barriers for both industry and academia, MCNC, and ARPA have developed a program which works to provide users with access to both MEMS processes and advanced integration techniques. The two distinct aspects of this program, the MUMPs and Smart MEMS, will be described in this paper. The multi-user MEMS processes (MUMPs) is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. MUMPs is a proof-of-concept and educational tool to aid the developemnt of MEMS in the domestic community. MUMPs technologies currently include a 3-layer polysilicon surface micromachining process and LIGA processes that provide reasonable design flexibility within set guidelines. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology.

Paper Details

Date Published: 19 September 1995
PDF: 10 pages
Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, (19 September 1995); doi: 10.1117/12.221300
Show Author Affiliations
Karen W. Markus, Microelectronics Ctr. of North Carolina (United States)
David A. Koester, Microelectronics Ctr. of North Carolina (United States)
Allen Cowen, Microelectronics Ctr. of North Carolina (United States)
Ramu Mahadevan, Microelectronics Ctr. of North Carolina (United States)
Vijayakumar R. Dhuler, Microelectronics Ctr. of North Carolina (United States)
D. Roberson, Microelectronics Ctr. of North Carolina (United States)
L. Smith, Microelectronics Ctr. of North Carolina (United States)


Published in SPIE Proceedings Vol. 2639:
Micromachining and Microfabrication Process Technology
Karen W. Markus, Editor(s)

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