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Proceedings Paper

Patterned eutectic bonding with Al/Ge thin films for MEMS
Author(s): Paul M. Zavracky; Bao Vu
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Paper Abstract

In this paper, we report our results using eutectic bonding with the aluminum/germanium alloy to create high quality bonds. The results of a series of experiments conducted to optimize eutectic alloy bonding for MEMS are described. Issues discussed include surface preparation, eutectic composition, bonding apparatus and bonding conditions (temperature and time).

Paper Details

Date Published: 19 September 1995
PDF: 7 pages
Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, (19 September 1995); doi: 10.1117/12.221299
Show Author Affiliations
Paul M. Zavracky, Northeastern Univ. (United States)
Bao Vu, Northeastern Univ. (United States)


Published in SPIE Proceedings Vol. 2639:
Micromachining and Microfabrication Process Technology
Karen W. Markus, Editor(s)

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