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Proceedings Paper

Batch-dissolved wafer process for low-cost sensor applications
Author(s): Steve T. Cho
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Paper Abstract

As microsensor technology continues to grow and mature, the issues of cost and manufactureability become key issues in determining whether silicon transducer technologies are commercially viable. The dissolved wafer process is an attractive manufacturing technology for the production of low cost, high volume transducers. The process requires only 3 masking steps and the tooling for micromachining is inexpensive. Six sigma level yield is attainable and the turnaround time for a lot is 1.5-2 weeks for one work shift operation. This technology is currently being implemented in commercial production low cost inertial instruments.

Paper Details

Date Published: 19 September 1995
PDF: 8 pages
Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, (19 September 1995); doi: 10.1117/12.221265
Show Author Affiliations
Steve T. Cho, Silicon Video Corp. (United States)

Published in SPIE Proceedings Vol. 2639:
Micromachining and Microfabrication Process Technology
Karen W. Markus, Editor(s)

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