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Proceedings Paper

Low-power chip-level optical interconnects based on bulk-silicon single-chip photonic transceivers
Author(s): Gyungock Kim; Hyundai Park; Jiho Joo; Ki-Seok Jang; Myung-Joon Kwack; Sanghoon Kim; In Gyoo Kim; Sun Ae Kim; Jin Hyuk Oh; Jaegyu Park; Sanggi Kim
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Paper Abstract

We present new scheme for chip-level photonic I/Os, based on monolithically integrated vertical photonic devices on bulk silicon, which increases the integration level of PICs to a complete photonic transceiver (TRx) including chip-level light source. A prototype of the single-chip photonic TRx based on a bulk silicon substrate demonstrated 20 Gb/s low power chip-level optical interconnects between fabricated chips, proving that this scheme can offer compact low-cost chip-level I/O solutions and have a significant impact on practical electronic-photonic integration in high performance computers (HPC), cpu-memory interface, 3D-IC, and LAN/SAN/data-center and network applications.

Paper Details

Date Published: 15 March 2016
PDF: 6 pages
Proc. SPIE 9753, Optical Interconnects XVI, 975315 (15 March 2016); doi: 10.1117/12.2212465
Show Author Affiliations
Gyungock Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
Hyundai Park, Electronics and Telecommunications Research Institute (Korea, Republic of)
Jiho Joo, Electronics and Telecommunications Research Institute (Korea, Republic of)
Ki-Seok Jang, Electronics and Telecommunications Research Institute (Korea, Republic of)
Myung-Joon Kwack, Electronics and Telecommunications Research Institute (Korea, Republic of)
Sanghoon Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
In Gyoo Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
Sun Ae Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
Jin Hyuk Oh, Electronics and Telecommunications Research Institute (Korea, Republic of)
Jaegyu Park, Electronics and Telecommunications Research Institute (Korea, Republic of)
Sanggi Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)


Published in SPIE Proceedings Vol. 9753:
Optical Interconnects XVI
Henning Schröder; Ray T. Chen, Editor(s)

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