Share Email Print

Proceedings Paper

microPREP: a new laser tool for high-volume sample preparation
Author(s): Uwe Wagner; Tino Petsch; Michael Krause; Thomas Höche
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Over the past fifty year, lasers have perpetuated to find new, often groundbreaking applications in science and technology. The most important features of lasers are that photons are inherently free of elemental contamination, extremely high energy densities can be focused in very small areas and the laser beam can be precisely positioned using deflection mirrors. By reducing pulse lengths from a few nanoseconds down to the picosecond or femtosecond range, material’s ablation is becoming increasingly "athermal", i.e. structure damage by local heating is reduced to well below a few microns. In view of these outstanding characteristics of lasers as tools for micromachining, it is very surprising that sample preparation for microstructure diagnostics so far hasn’t made use of laser technology.

microPREPTM, the all-new, patented laser-micromachining tool developed by 3D-Micromac is the first instrument to make fast, clean, and efficient laser ablation available for the preparation of samples for microstructure diagnostics. Exemplified for a sample to be investigated by transmission electron microscopy (TEM) and following a three-stage approach, a supporting basic structure is cut from the feedstock first. Second, the supported structure is thinned down to a few micron of residual thickness and third, the supported and thinned structure is polished using an ion broad beam.

Illustrated by numerous examples, it is shown that this technology is ready to be applied on different areas of microstructure diagnostics and has very high potential for failure diagnostics.

Paper Details

Date Published: 4 March 2016
PDF: 9 pages
Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 97360C (4 March 2016); doi: 10.1117/12.2212444
Show Author Affiliations
Uwe Wagner, 3D-Micromac AG (Germany)
Tino Petsch, 3D-Micromac AG (Germany)
Michael Krause, Fraunhofer Institute for Mechanics of Materials (Germany)
Thomas Höche, Fraunhofer Institute for Mechanics of Materials (Germany)

Published in SPIE Proceedings Vol. 9736:
Laser-based Micro- and Nanoprocessing X
Udo Klotzbach; Kunihiko Washio; Craig B. Arnold, Editor(s)

© SPIE. Terms of Use
Back to Top