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Proceedings Paper

Package and module substrate interconnect evaluation by thermal time domain reflectometry (TTDR)
Author(s): Sugoog Shon; Robert H. Flake; Anthony Wong
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Paper Abstract

A TAB package inner lead interconnect is characterized experimentally by thermal time- domain reflectometry. In order to estimate the low frequency thermal characteristic impedance of the lead in a module substrate, we apply TPA (total pulse area) steady state methodology to analyze transient TTDR measurements. TAB ILB bond thicknesses are measured and compared with estimates of the thermal resistances of short portions of the inner leads terminating at the ILB. The ILB thermal constriction and contact resistance of the bonds measured appear to be negligible compared to the lead resistance.

Paper Details

Date Published: 18 September 1995
PDF: 8 pages
Proc. SPIE 2638, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing II, (18 September 1995); doi: 10.1117/12.221209
Show Author Affiliations
Sugoog Shon, Univ. of Texas/Austin (United States)
Robert H. Flake, Univ. of Texas/Austin (United States)
Anthony Wong, Univ. of Texas/Austin (United States)


Published in SPIE Proceedings Vol. 2638:
Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing II
John K. Lowell; Ray T. Chen; Jagdish P. Mathur, Editor(s)

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