Share Email Print

Proceedings Paper

Packaging of MEMS devices
Author(s): Albert K. Hu; Evan D. Green
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

This paper examines issues in the packaging of silicon-micromachined devices. Standard microelectonics packaging seeks to physically isolate the integrated circuits from harmful elements in the environment, to provide mechanical strength for the die, to facilitate thermal dissipation, and to sustain electrical communication with outside circuits. However, due to the many novel applications of MEMS devices, new sets of packaging requirements need to be met and further research on packaging technology to meet non-traditional requirements are needed.

Paper Details

Date Published: 15 September 1995
PDF: 8 pages
Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); doi: 10.1117/12.221179
Show Author Affiliations
Albert K. Hu, San Jose State Univ. (United States)
Evan D. Green, San Jose State Univ. (United States)

Published in SPIE Proceedings Vol. 2642:
Micromachined Devices and Components
Ray M. Roop; Kevin H. Chau, Editor(s)

© SPIE. Terms of Use
Back to Top