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Proceedings Paper

Effect of machine parameters on polymer die attach dispense and a method to optimize them
Author(s): Dave S. Mahadevan
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Paper Abstract

For consistent optimum electrical performance of a pressure sensor device, the die-attach process is very critical. A polymer adhesive is used for attaching the pressure sensor die to the plastic package. The polymer dispense process depends on the machine (die bonder) set up variables. The significant machine set up variables were the time of dispense, the pressure of dispense, and the gap between the dispense nozzle and the surface of dispense. A response surface design model was used to find the relation between the machine ste up variables and the response surface variables. It was found that the time of dispense, the interaction of the time and gap, square of time were the important variables that affect the result of dispense. A process window for machine set up variables were found to achieve optimum and consistent adhesive dispense.

Paper Details

Date Published: 15 September 1995
PDF: 8 pages
Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); doi: 10.1117/12.221178
Show Author Affiliations
Dave S. Mahadevan, Motorola (United States)


Published in SPIE Proceedings Vol. 2642:
Micromachined Devices and Components
Ray M. Roop; Kevin H. Chau, Editor(s)

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