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Proceedings Paper

Multiaxis microcoil sensors in standard CMOS
Author(s): Beverley Eyre; Kristofer S. J. Pister; Walter Gekelman
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Paper Abstract

The subsystems of an integrated MEMS 3D magnetic sensor are described and created using a standard CMOS fabrication process. For the completed sensor, after fabrication, the chip is micromachined and the sensor is assembled. The sensing is done by a two layer, aluminum coil whose equivalent area is specific to being sent off chip. The sensitivity and resolution of the transducer is found and shown to be a function of frequency. The frequency response is shown to be linear. Both higher sensitivity and finer resolution can be achieved by increasing the equivalent area of the micro-coil or by using a higher input frequency. The next phase is to fabricate the complete three axis system with two perpendicular coils rotated off the substrate and one remaining on the substrate.

Paper Details

Date Published: 15 September 1995
PDF: 9 pages
Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); doi: 10.1117/12.221168
Show Author Affiliations
Beverley Eyre, Univ. of California/Los Angeles (United States)
Kristofer S. J. Pister, Univ. of California/Los Angeles (United States)
Walter Gekelman, Univ. of California/Los Angeles (United States)

Published in SPIE Proceedings Vol. 2642:
Micromachined Devices and Components
Ray M. Roop; Kevin H. Chau, Editor(s)

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