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Proceedings Paper

Monolithic multiple axis accelerometer design in standard CMOS
Author(s): Brett Warneke; Eric G. Hoffman; Kristofer S. J. Pister
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Paper Abstract

Using a single maskless postprocessing step we have developed an accelerometer in a standard commercial CMOS process capable of a sensitive axis parallel or perpendicular to the die surface. Out postprocess is realized using xenon difluoride (XeF2) as a bulk etchant. The combination of this etchant and the standard CMOS process allows realization of cantilevers with piezoresistive sensors in all spacial coordinates from a widely-accessible source and at a minimal cost. Fabrication of accelerometers for all three axes and associated electronics on a single piece of silicon reduces the cost of 3D acceleration detection while increasing sensor reliability.

Paper Details

Date Published: 15 September 1995
PDF: 8 pages
Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); doi: 10.1117/12.221155
Show Author Affiliations
Brett Warneke, Univ. of California/Los Angeles (United States)
Eric G. Hoffman, Univ. of California/Los Angeles (United States)
Kristofer S. J. Pister, Univ. of California/Los Angeles (United States)

Published in SPIE Proceedings Vol. 2642:
Micromachined Devices and Components
Ray M. Roop; Kevin H. Chau, Editor(s)

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