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Proceedings Paper

Formation of copper micropatterns by laser direct writing using copper nanoparticle ink
Author(s): Akira Watanabe; Jinguang Cai; Gang Qin; Lidan Fan
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Paper Abstract

The 2D and 3D laser direct writing using Cu nanoparticle ink were studied using a compact blue-violet semiconductor laser. The laser direct writing based on a motion controller and G-code language program on PC enabled to prepare various kinds of shaped Cu grids which can be easily designed on-demand. A Cu grid pattern was prepared on a flexible and transparent polymer substrate and applied to a stress sensor. A star-shaped grid was fabricated a polymer substrate and the performance as a stress sensor for detecting the motion of human hand devises was demonstrated toward wearable electronics. In the preliminary 3D study, we have employed the layer-by-layer formation of a 3D structure, where cycle of the spin-coating of a metal nanoparticle ink and the laser direct writing were repeated. The 3D microstructures prepared by the 3D laser direct writing using Ag and Cu nanoparticle inks suggested the possibility of a 3D interconnection.

Paper Details

Date Published: 4 March 2016
PDF: 8 pages
Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 97360D (4 March 2016); doi: 10.1117/12.2211215
Show Author Affiliations
Akira Watanabe, Tohoku Univ. (Japan)
Jinguang Cai, Tohoku Univ. (Japan)
Gang Qin, Henan Polytechnic Univ. (China)
Lidan Fan, Henan Polytechnic Univ. (China)


Published in SPIE Proceedings Vol. 9736:
Laser-based Micro- and Nanoprocessing X
Udo Klotzbach; Kunihiko Washio; Craig B. Arnold, Editor(s)

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