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Proceedings Paper

Future manufacturing technology in the year 2000
Author(s): Tadahiro Ohmi
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Paper Abstract

High throughput and low cost production with 100% yield is strictly demanded for ULSI manufacturing, where a decrease of minimum feature size of device and an increase of wafer diameter are continuously enhanced for future. It will be available based on an introduction of simplified processing due to simplified device structure by introducing new concept device and new materials to Si technology. Simplification of manufacturing process becomes available based on fully understanding of process mechanisms in a scientific manner, resulting in a dramatic reduction of process steps.

Paper Details

Date Published: 15 September 1995
PDF: 7 pages
Proc. SPIE 2636, Microelectronic Device and Multilevel Interconnection Technology, (15 September 1995); doi: 10.1117/12.221121
Show Author Affiliations
Tadahiro Ohmi, Tohoku Univ. (Japan)


Published in SPIE Proceedings Vol. 2636:
Microelectronic Device and Multilevel Interconnection Technology
Ih-Chin Chen; Girish A. Dixit; Trung Tri Doan; Nobuo Sasaki, Editor(s)

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