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Proceedings Paper

Integrated high power VCSEL systems
Author(s): Holger Moench; Ralf Conrads; Stephan Gronenborn; Xi Gu; Michael Miller; Pavel Pekarski; Jens Pollmann-Retsch; Armand Pruijmboom; Ulrich Weichmann
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Paper Abstract

High power VCSEL systems are a novel laser source used for thermal treatment in industrial manufacturing. These systems will be applied in many applications, which have not used a laser source before. This is enabled by the unique combination of efficiency, compactness and robustness. High power VCSEL system technology encompasses elements far beyond the VCSEL chip itself: i.e. heat sinks, bonding technology and integrated optics. This paper discusses the optimization of these components and processes specifically for building high-power laser systems with VCSEL arrays. New approaches help to eliminate components and process steps and make the system more robust and easier to manufacture.

New cooler concepts with integrated electrical and mechanical interfaces have been investigated and offer advantages for high power system design.

The bonding process of chips on sub-mounts and coolers has been studied extensively and for a variety of solder materials. High quality of the interfaces as well as good reliability under normal operation and thermal cycling have been realized. A viable alternative to soldering is silver sintering. The very positive results which have been achieved with a variety of technologies indicate the robustness of the VCSEL chips and their suitability for high power systems.

Beam shaping micro-optics can be integrated on the VCSEL chip in a wafer scale process by replication of lenses in a polymer layer. The performance of VCSEL arrays with integrated collimation lenses has been positively evaluated and the integrated chips are fully compatible with all further assembly steps.

The integrated high power systems make the application even easier and more robust. New examples in laser material processing and pumping of solid state lasers are presented.

Paper Details

Date Published: 4 March 2016
PDF: 11 pages
Proc. SPIE 9733, High-Power Diode Laser Technology and Applications XIV, 97330V (4 March 2016); doi: 10.1117/12.2210909
Show Author Affiliations
Holger Moench, Philips GmbH Photonics Aachen (Germany)
Ralf Conrads, Philips GmbH Photonics Aachen (Germany)
Stephan Gronenborn, Philips GmbH Photonics Aachen (Germany)
Xi Gu, Philips Photonics Modules (Netherlands)
Michael Miller, Philips GmbH U-L-M Photonics (Germany)
Pavel Pekarski, Philips GmbH Photonics Aachen (Germany)
Jens Pollmann-Retsch, Philips GmbH Photonics Aachen (Germany)
Armand Pruijmboom, Philips Photonics Modules (Netherlands)
Ulrich Weichmann, Philips GmbH Photonics Aachen (Germany)


Published in SPIE Proceedings Vol. 9733:
High-Power Diode Laser Technology and Applications XIV
Mark S. Zediker, Editor(s)

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