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Proceedings Paper

Reliability tests of ultrasonic and thermosonic wire bonds
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Paper Abstract

This paper presents analysis of mechanical strength and reliability of wire bonds in context of the applied bonding technique, wire material and substrate type used as well as bonding parameters. The investigation conducted includes a selection of parameters affecting process of effective wire bonds forming by 53XX F&K Delvotec Bonder and implementation of wire bonds with ultrasonic and thermosonic techniques, using various substrates combined with gold and aluminum 25 μm diameter wires. Furthermore, reliability and quality test made by bond pull technique have been presented and discussed.

Paper Details

Date Published: 11 September 2015
PDF: 9 pages
Proc. SPIE 9662, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2015, 966245 (11 September 2015); doi: 10.1117/12.2205412
Show Author Affiliations
T. Lizak, Lublin Univ. of Technology (Poland)
A. Kociubiński, Lublin Univ. of Technology (Poland)


Published in SPIE Proceedings Vol. 9662:
Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2015
Ryszard S. Romaniuk, Editor(s)

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