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Proceedings Paper

Thermal research of infrared sight signal processing circuit board under temperature shock environment
Author(s): Youtang Gao; Huang Ding; Jianliang Qiao; Yuan Xu; Jun Niu
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Paper Abstract

Thermal stability technology of signal processing circuit infrared sight is studied under temperature shock. Model parameters and geometry is configured for FPGA devices (EP1C20F400C8), solder material and PCB. Signal circuit boards of full array BGA distribution are simulated and analyzed by thermal shock and waveform through engineering finite element analysis software. Because solders of the whole model have strong stress along Y direction, initial stress constraints along Y direction are primarily considered when the partial model of single solder is imposed by thermal load. When absolute thermal loads stresses of diagonal nodes with maximum strains are separated from the whole model, interpolation is processed according to thermal loads circulation. Plastic strains and thermal stresses of nodes in both sides of partial model are obtained. The analysis results indicate that with thermal load circulation, maximum forces of each circulation along Y direction are increasingly enlarged and with the accumulation of plastic strains of danger point, the composition will become invalid in the end.

Paper Details

Date Published: 15 October 2015
PDF: 7 pages
Proc. SPIE 9671, AOPC 2015: Advances in Laser Technology and Applications, 96710D (15 October 2015); doi: 10.1117/12.2202353
Show Author Affiliations
Youtang Gao, Nanyang Institute and Technology (China)
Huang Ding, Nanyang Institute of Technology (China)
Nanjing Univ. of Science and Technology (China)
Jianliang Qiao, Nanyang Institute of Technology (China)
Yuan Xu, Nanjing Univ. of Science and Technology (China)
Jun Niu, Nanyang Institute of Technology (China)


Published in SPIE Proceedings Vol. 9671:
AOPC 2015: Advances in Laser Technology and Applications
Shibin Jiang; Lijun Wang; Chun Tang; Yong Cheng, Editor(s)

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