Share Email Print
cover

Proceedings Paper

Direct metal transfer printing on flexible substrate for fabricating optics functional devices
Author(s): Yingjie Jiang; Xiaohong Zhou; Feng Zhang; Zhenwu Shi; Linsen Chen; Changsi Peng
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

New functional materials and devices based on metal patterns can be widely used in many new and expanding industries,such as flat panel displays, alternative energy,sensors and so on. In this paper, we introduce a new transfer printing method for fabricating metal optics functional devices. This method can directly transfer a metal pattern from a polyethylene terephthalate (PET)supported UV or polydimethylsiloxane (PDMS) pattern to another PET substrate. Purely taking advantage of the anaerobic UV curing adhesive (a-UV) on PET substrate, metal film can be easily peeled off from micro/nano-structured surface. As a result, metal film on the protrusion can be selectively transferred onto the target substrate, to make it the metal functional surface. But which on the bottom can not be transferred. This method provides low cost fabrication of metal thin film devices by avoiding high cost lithography process. Compared with conventional approach, this method can get more smooth rough edges and has wider tolerance range for the original master mold. Future developments and potential applications of this metal transfer method will be addressed.

Paper Details

Date Published: 6 November 2015
PDF: 6 pages
Proc. SPIE 9667, International Workshop on Thin Films for Electronics, Electro-Optics, Energy, and Sensors, 966707 (6 November 2015); doi: 10.1117/12.2199655
Show Author Affiliations
Yingjie Jiang, Soochow Univ. (China)
Xiaohong Zhou, Soochow Univ. (China)
Feng Zhang, Soochow Univ. (China)
Zhenwu Shi, Soochow Univ. (China)
Linsen Chen, Soochow Univ. (China)
Changsi Peng, Soochow Univ. (China)


Published in SPIE Proceedings Vol. 9667:
International Workshop on Thin Films for Electronics, Electro-Optics, Energy, and Sensors
Guru Subramanyam, Editor(s)

© SPIE. Terms of Use
Back to Top