Share Email Print
cover

Proceedings Paper

Research of new packaging and cooling technique for high power fiber laser used pump coupler
Author(s): Wei Mu; Xu Si; Ya-jun Lin; Cheng-lin Xu; Yun-liang Ma; Chun Xiao
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

This article analyzes the advantages and disadvantages of a packaging structure for pump coupler, where common heat conduction material is used. In this study, the possibility of using new technology of thermal conductivity is discussed. We also proposes a solution that make the function and effect of package more uniform. A serial of experiments are done for research the cooling effect and the working reliability of the fiber combiners and couplers. Experiment proves that after improved method of package, the cooling speed increases significantly comparing the sample with old type of package technique. The technique discussed in this paper will make the high power fiber laser working long time with steady power output and high efficiency.

Paper Details

Date Published: 15 October 2015
PDF: 6 pages
Proc. SPIE 9671, AOPC 2015: Advances in Laser Technology and Applications, 96710T (15 October 2015); doi: 10.1117/12.2199406
Show Author Affiliations
Wei Mu, China Electronics Technology Group Corp. (China)
Xu Si, China Electronics Technology Group Corp. (China)
Ya-jun Lin, China Electronics Technology Group Corp. (China)
Cheng-lin Xu, China Electronics Technology Group Corp. (China)
Yun-liang Ma, China Electronics Technology Group Corp. (China)
Chun Xiao, China Electronics Technology Group Corp. (China)


Published in SPIE Proceedings Vol. 9671:
AOPC 2015: Advances in Laser Technology and Applications
Shibin Jiang; Lijun Wang; Chun Tang; Yong Cheng, Editor(s)

© SPIE. Terms of Use
Back to Top