Share Email Print
cover

Proceedings Paper

The capability of lithography simulation based on MVM-SEM® system
Author(s): Shingo Yoshikawa; Nobuaki Fujii; Koichi Kanno; Hidemichi Imai; Katsuya Hayano; Hiroyuki Miyashita; Soichi Shida; Tsutomu Murakawa; Masayuki Kuribara; Jun Matsumoto; Takayuki Nakamura; Shohei Matsushita; Daisuke Hara; Linyong Pang
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The 1Xnm technology node lithography is using SMO-ILT, NTD or more complex pattern. Therefore in mask defect inspection, defect verification becomes more difficult because many nuisance defects are detected in aggressive mask feature. One key Technology of mask manufacture is defect verification to use aerial image simulator or other printability simulation. AIMS™ Technology is excellent correlation for the wafer and standards tool for defect verification however it is difficult for verification over hundred numbers or more.

We reported capability of defect verification based on lithography simulation with a SEM system that architecture and software is excellent correlation for simple line and space.[1]

In this paper, we use a SEM system for the next generation combined with a lithography simulation tool for SMO-ILT, NTD and other complex pattern lithography. Furthermore we will use three dimension (3D) lithography simulation based on Multi Vision Metrology SEM system. Finally, we will confirm the performance of the 2D and 3D lithography simulation based on SEM system for a photomask verification.

Paper Details

Date Published: 23 October 2015
PDF: 9 pages
Proc. SPIE 9635, Photomask Technology 2015, 96351X (23 October 2015); doi: 10.1117/12.2197818
Show Author Affiliations
Shingo Yoshikawa, Dai Nippon Printing Co., Ltd. (Japan)
Nobuaki Fujii, Dai Nippon Printing Co., Ltd. (Japan)
Koichi Kanno, Dai Nippon Printing Co., Ltd. (Japan)
Hidemichi Imai, Dai Nippon Printing Co., Ltd. (Japan)
Katsuya Hayano, Dai Nippon Printing Co., Ltd. (Japan)
Hiroyuki Miyashita, Dai Nippon Printing Co., Ltd. (Japan)
Soichi Shida, Advantest Corp. (Japan)
Tsutomu Murakawa, Advantest Corp. (Japan)
Masayuki Kuribara, Advantest Corp. (Japan)
Jun Matsumoto, Advantest Corp. (Japan)
Takayuki Nakamura, Advantest Corp. (Japan)
Shohei Matsushita, D2S K.K. (Japan)
Daisuke Hara, D2S K.K. (Japan)
Linyong Pang, D2S, Inc. (United States)


Published in SPIE Proceedings Vol. 9635:
Photomask Technology 2015
Naoya Hayashi, Editor(s)

© SPIE. Terms of Use
Back to Top