Share Email Print

Proceedings Paper

Research on ultrasonic vibration aided femtosecond laser machining process of transparent materials
Author(s): Yutang Dai; Bin Liu; Guanglin Yin; Tao Li; Joseph Muna Karanja
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A new process of femtosecond laser micromachining with ultrasonic vibration aided is proposed. An ultrasonic aided device has been designed, and the laser micromachining experiments of transparent materials have been carried out. The effects of the ultrasonic vibration with different power on surface quality and the drilling depth have been investigated, and the mechanism of the ultrasonic vibration aided laser machining has been analyzed. After introducing the ultrasonic vibration device, the residue debris on surface of the ablated trench is significantly reduced, and the drilling depth is increased. These results show that, ultrasonic vibration can effectively improve the surface quality of material processing, increase the depth of the drilling hole and promote the processing efficiency of the femtosecond laser.

Paper Details

Date Published: 22 August 2015
PDF: 6 pages
Proc. SPIE 9656, International Symposium on Photonics and Optoelectronics 2015, 965606 (22 August 2015); doi: 10.1117/12.2196950
Show Author Affiliations
Yutang Dai, Wuhan Univ. of Technology (China)
Bin Liu, Wuhan Univ. of Technology (China)
Guanglin Yin, Wuhan Univ. of Technology (China)
Tao Li, Wuhan Univ. of Technology (China)
Joseph Muna Karanja, Wuhan Univ. of Technology (China)

Published in SPIE Proceedings Vol. 9656:
International Symposium on Photonics and Optoelectronics 2015
Zhiping Zhou, Editor(s)

© SPIE. Terms of Use
Back to Top