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Proceedings Paper

YieldStar based reticle 3D measurements and its application
Author(s): Vidya Vaenkatesan; Twan Schellekens; Natalia Davydova; Harm Dillen; Joep van Dijk
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Paper Abstract

YieldStar (YS) is an ASML-built scatterometry tool with well-established capability to measure wafer Critical Dimension (CD), Overlay and Focus. In a feasibility study, the application range of YS was extended to measure CD patterns in EUV reticles (absorber CD, height, Side Wall Angle-SWA). The measured data compared well with the available data from CD-SEM and AFM. Further the YS measured data was used to mathematically separate the reticle induced fingerprint from the scanner fingerprint.

Paper Details

Date Published: 4 September 2015
PDF: 6 pages
Proc. SPIE 9661, 31st European Mask and Lithography Conference, 96610N (4 September 2015); doi: 10.1117/12.2196665
Show Author Affiliations
Vidya Vaenkatesan, ASML Netherlands B.V (Netherlands)
Twan Schellekens, ASML Netherlands B.V. (Netherlands)
Natalia Davydova, ASML Netherlands B.V. (Netherlands)
Harm Dillen, ASML Netherlands B.V. (Netherlands)
Joep van Dijk, ASML Netherlands B.V. (Netherlands)


Published in SPIE Proceedings Vol. 9661:
31st European Mask and Lithography Conference
Uwe F.W. Behringer; Jo Finders, Editor(s)

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