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Proceedings Paper

AGILE integration into APC for high mix logic fab
Author(s): M. Gatefait; A. Lam; B. Le Gratiet; M. Mikolajczak; V. Morin; N. Chojnowski; Z. Kocsis; I. Smith; J. Decaunes; A. Ostrovsky; C. Monget
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Paper Abstract

For C040 technology and below, photolithographic depth of focus control and dispersion improvement is essential to secure product functionality. Critical 193nm immersion layers present initial focus process windows close to machine control capability. For previous technologies, the standard scanner sensor (Level sensor - LS) was used to map wafer topology and expose the wafer at the right Focus. Such optical embedded metrology, based on light reflection, suffers from reading issues that cannot be neglected anymore. Metrology errors are correlated to inspected product area for which material types and densities change, and so optical properties are not constant. Various optical phenomena occur across the product field during wafer inspection and have an effect on the quality and position of the reflected light. This can result in incorrect heights being recorded and exposures possibly being done out of focus. Focus inaccuracy associated to aggressive process windows on critical layers will directly impact product realization and therefore functionality and yield. ASML has introduced an air gauge sensor to complement the optical level sensor and lead to optimal topology metrology. The use of this new sensor is managed by the AGILE (Air Gauge Improved process LEveling) application. This measurement with no optical dependency will correct for optical inaccuracy of level sensor, and so improve best focus dispersion across the product. Due to the fact that stack complexity is more and more important through process steps flow, optical perturbation of standard Level sensor metrology is increasing and is becoming maximum for metallization layers. For these reasons AGILE feature implementation was first considered for contact and all metal layers. Another key point is that standard metrology will be sensitive to layer and reticle/product density. The gain of Agile will be enhanced for multiple product contribution mask and for complex System on Chip. Into ST context (High mix logic Fab) in term of product and technology portfolio AGILE corrects for up to 120nm of product topography error on process layer with less than 50nm depth of focus Based on tool functionalities delivered by ASML and on high volume manufacturing requirement, AGILE integration is a real challenge. Regarding ST requirements “Automatic AGILE” functionality developed by ASML was not a turnkey solution and a dedicated functionality was needed. A “ST homemade AGILE integration” has been fully developed and implemented within ASML and ST constraints. This paper describes this integration in our Advanced Process Control platform (APC).

Paper Details

Date Published: 4 September 2015
PDF: 7 pages
Proc. SPIE 9661, 31st European Mask and Lithography Conference, 96610P (4 September 2015); doi: 10.1117/12.2194746
Show Author Affiliations
M. Gatefait, STMicroelectronics (France)
A. Lam, STMicroelectronics (France)
B. Le Gratiet, STMicroelectronics (France)
M. Mikolajczak, STMicroelectronics (France)
V. Morin, STMicroelectronics (France)
N. Chojnowski, STMicroelectronics (France)
Z. Kocsis, STMicroelectronics (France)
I. Smith, STMicroelectronics (France)
J. Decaunes, STMicroelectronics (France)
A. Ostrovsky, STMicroelectronics (France)
C. Monget, STMicroelectronics (France)


Published in SPIE Proceedings Vol. 9661:
31st European Mask and Lithography Conference
Uwe F.W. Behringer; Jo Finders, Editor(s)

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