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Proceedings Paper

Automated infrared scanning in Cray Y-MP production
Author(s): Christine J. Anderson
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Paper Abstract

Thermal stress of an integrated circuit (IC) has a direct effect on the reliability of the computer system. Cray Research, Inc., designer and manufacturer of large scale general purpose supercomputers, is currenfly screening all Cray Y-MP modules for thermal stress to increase the reliability of this product. The requirements for thermal screening in our production environment consisted of minimizing cost, decreasing production time and maintenance, and providing a testing procedure that would not require using highly trained personneL The commercially available equipment evaluated did not meet all of these criteria. The infrared (IR) scanning tester developed by Cray Research provides accurate measurements of IC case temperatures and automated analysis capabilities with a minimum of operator intervention or evaluation. The tester employs an Inframetrics Model 600 IR Imaging Radiometer that is controlled by a personal computer system and can be operated with a minimal amount of training by any production worker. The computer also controls and monitors various tester functions such as cycling the power supplies and monitoring the current draw of the module. The IR scanning capabilities provided by this system have been an invaluable tool in the production process. The JR scanning tester has also been useful for performing various thermal experiments throughout the company, as well as providing a thermal record of each Cray YMP module produced. This paper describes the design and operation of the IR scanning tester and provides algorithms for remote operation of an Inframetrics Model 600 JR Imaging Radiometer.

Paper Details

Date Published: 1 March 1990
PDF: 10 pages
Proc. SPIE 1313, Thermosense XII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications, (1 March 1990); doi: 10.1117/12.21939
Show Author Affiliations
Christine J. Anderson, Cray Research, Inc. (United States)


Published in SPIE Proceedings Vol. 1313:
Thermosense XII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications
Sharon A. Semanovich, Editor(s)

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