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Proceedings Paper

A miniaturized laser illumination module
Author(s): A. T. Winzer; J. Freitag; P. Dannberg; M. Hintz; M. Schädel; V. Sandhya; H.-J. Freitag
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Paper Abstract

We present a wafer-based technology for mass production of miniaturized laser units. Heart of the approach is a glass wafer, comprising a metal structure acting as electrical contact, optical aperture and mechanical carrier of up to several thousands of flipped surface emitting laser diodes on one side, and a polymer-on-glass micro optical array on the other side. Mounting and characterization methods performed on wafer level are presented. After separation the size of a single laser unit is as small as 640 x 700 x 1400 μm3 and achieves spot diameters below 1 mm at distance of 120 mm. Performance and excellent cost potential allows for application in optical micro sensors and consumer electronics.

Paper Details

Date Published: 23 September 2015
PDF: 9 pages
Proc. SPIE 9626, Optical Systems Design 2015: Optical Design and Engineering VI, 96261X (23 September 2015); doi: 10.1117/12.2191318
Show Author Affiliations
A. T. Winzer, CiS Forschungsinstitut für Mikrosensorik GmbH (Germany)
J. Freitag, CiS Forschungsinstitut für Mikrosensorik GmbH (Germany)
P. Dannberg, Fraunhofer-Institut für Angewandte Optik und Feinmechanik (Germany)
M. Hintz, CiS Forschungsinstitut für Mikrosensorik GmbH (Germany)
M. Schädel, CiS Forschungsinstitut für Mikrosensorik GmbH (Germany)
V. Sandhya, CiS Forschungsinstitut für Mikrosensorik GmbH (Germany)
Karlsruhe Univ. of Applied Sciences (Germany)
H.-J. Freitag, CiS Forschungsinstitut für Mikrosensorik GmbH (Germany)


Published in SPIE Proceedings Vol. 9626:
Optical Systems Design 2015: Optical Design and Engineering VI
Laurent Mazuray; Rolf Wartmann; Andrew P. Wood, Editor(s)

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