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Proceedings Paper

In-line roll-to-roll metrology for flexible electronics
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Paper Abstract

The flexible electronics market continues to grow at a rapid pace. Increasing numbers of applications employ the flexible components including displays, biomedical devices, smart apparel, and advanced sensors. To maintain performance and lifetime, many characteristics of the substrate and deposited layers must be monitored. This includes defects, surface roughness, and feature alignment. Ideally, in-situ metrology can be employed in roll-to-roll (R2R) equipment to allow for real-time process control. This presents the necessary three-dimensional metrology system with several challenging requirements: high vertical and transverse resolution, large field-of-view, extremely fast measurement times, and robust vibration immunity. This paper will discuss the design and performance of a compact, low-cost, large-field interferometric probe for in-situ measurement of R2R substrates. Samples with a variety of known and unknown features and roughnesses will be measured to characterize the performance of the system. Static and moving substrates will be measured to examine effects on results. Optimization of processing to allow for on-board analysis will be examined. Lastly, the paper will discuss how such probes may be arrayed to provide a high degree of areal coverage of the flexible substrate under test.

Paper Details

Date Published: 3 September 2015
PDF: 6 pages
Proc. SPIE 9576, Applied Advanced Optical Metrology Solutions, 957603 (3 September 2015); doi: 10.1117/12.2189905
Show Author Affiliations
Brad Kimbrough, 4D Technology Corp. (United States)
Erik Novak, 4D Technology Corp. (United States)

Published in SPIE Proceedings Vol. 9576:
Applied Advanced Optical Metrology Solutions
Erik Novak; James D. Trolinger, Editor(s)

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