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Proceedings Paper

Quantitative phase measurement for wafer-level optics
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Paper Abstract

Wafer-level-optics now is widely used in smart phone camera, mobile video conferencing or in medical equipment that require tiny cameras. Extracting quantitative phase information has received increased interest in order to quantify the quality of manufactured wafer-level-optics, detect defective devices before packaging, and provide feedback for manufacturing process control, all at the wafer-level for high-throughput microfabrication. We demonstrate two phase imaging methods, digital holographic microscopy (DHM) and Transport-of-Intensity Equation (TIE) to measure the phase of the wafer-level lenses. DHM is a laser-based interferometric method based on interference of two wavefronts. It can perform a phase measurement in a single shot. While a minimum of two measurements of the spatial intensity of the optical wave in closely spaced planes perpendicular to the direction of propagation are needed to do the direct phase retrieval by solving a second-order differential equation, i.e., with a non-iterative deterministic algorithm from intensity measurements using the Transport-of-Intensity Equation (TIE). But TIE is a non-interferometric method, thus can be applied to partial-coherence light. We demonstrated the capability and disability for the two phase measurement methods for wafer-level optics inspection.

Paper Details

Date Published: 17 July 2015
PDF: 12 pages
Proc. SPIE 9524, International Conference on Optical and Photonic Engineering (icOPEN 2015), 95242J (17 July 2015); doi: 10.1117/12.2189703
Show Author Affiliations
Weijuan Qu, Ngee Ann Polytechnic (Singapore)
Yongfu Wen, Ngee Ann Polytechnic (Singapore)
Zhaomin Wang, Ngee Ann Polytechnic (Singapore)
Fang Yang, Ngee Ann Polytechnic (Singapore)
Lei Huang, Brookhaven National Lab. (United States)
Chao Zuo, Nanjing Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 9524:
International Conference on Optical and Photonic Engineering (icOPEN 2015)
Anand K. Asundi; Yu Fu, Editor(s)

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