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Proceedings Paper

Using frictional power to model LSST removal with conventional abrasives
Author(s): Richard G. Allen; William H. Hubler
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Paper Abstract

The stressed lap on the Large Polishing Machine (LPM) at the University of Arizona Richard F. Caris Mirror Lab has recently been used to polish the M1 and M3 surfaces of the 8.4-m mirror for the Large Synoptic Survey Telescope (LSST). Loadcells in the three 4-bar links that connect this lap to the spindle of the machine allow the translational forces and torque on the lap to be measured once a second. These force readings and all other available machine parameters are recorded in history files that can be used to create a 2D removal map from one or more polishing runs. While the Preston equation has been used for many years to predict removal in a conventional polishing process, we have adopted a new equation that assumes that removal is proportional to the energy that is transferred from the lap to the substrate via friction. Specifically, the instantaneous removal rate at any point is defined to be the product of four parameters – an energy conversion factor which we call the Allen coefficient, the coefficient of friction, the lap pressure, and the speed of the lap. The Allen coefficient is the ratio of volumetric removal to frictional energy for a particular combination of pad material, abrasive, and substrate. Because our calculations take into account changes in the coefficient of friction between the lap and mirror, our 2D removal maps usually correlate well with optical data. Removal maps for future polishing strokes are created in simulations that track the position and speed of individual lap pads.

Paper Details

Date Published: 27 August 2015
PDF: 12 pages
Proc. SPIE 9575, Optical Manufacturing and Testing XI, 95750Q (27 August 2015); doi: 10.1117/12.2188968
Show Author Affiliations
Richard G. Allen, The Univ. of Arizona (United States)
William H. Hubler, The Univ. of Arizona (United States)


Published in SPIE Proceedings Vol. 9575:
Optical Manufacturing and Testing XI
Oliver W. Fähnle; Ray Williamson; Dae Wook Kim, Editor(s)

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