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Proceedings Paper

DLC and AlN thin films influence the thermal conduction of HPLED light
Author(s): Ming Seng Hsu; Ching Yao Hsu; Jen Wei Huang; Feng Lin Shyu
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Paper Abstract

Thermal dissipation had an important influence in the effect and life of light emitting diodes (LED) because it enables transfer the heat away from electric device to the aluminum plate that can be used for heat removal. In the industrial processing, the quality of the thermal dissipation decides by the gumming technique between the PCB and aluminum plate. In this study, we fabricated double layer ceramic thin films of diamond like carbon (DLC) and alumina nitride (AlN) by vacuum sputtering soldered the substrate of high power light emitting diodes (HPLED) light to check the heat conduction. The ceramic dielectric coatings were characterized by several subsequent analyses, especially the measurement of real work temperature. The X-Ray photoelectron spectroscopy (XPS) patterns reveal those ceramic phases were successfully grown onto the substrate. The work temperatures show DLC and AlN films coating had limited the heat transfer by the lower thermal conductivity of these ceramic films. Obviously, it hadn’t transferred heat and limited work temperature of HPLED better than DLC thin film only.

Paper Details

Date Published: 26 August 2015
PDF: 6 pages
Proc. SPIE 9586, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications IX, 958614 (26 August 2015); doi: 10.1117/12.2187304
Show Author Affiliations
Ming Seng Hsu, Chinese Military Academy (Taiwan)
Ching Yao Hsu, Cantwell-Sacred Heart of Mary High School (United States)
Jen Wei Huang, Chinese Military Academy (Taiwan)
Feng Lin Shyu, Chinese Military Academy (Taiwan)

Published in SPIE Proceedings Vol. 9586:
Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications IX
Shizhuo Yin; Ruyan Guo, Editor(s)

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