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Proceedings Paper

High-performance MCP-based imaging detector
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Paper Abstract

We have previously demonstrated the enhanced performance of progressive geometry readouts, such as the SPAN two dimensional charge division readout, in MCP based detectors. The nine electrode two-dimensional Vernier readout described in this paper is the latest development in this series of devices. The Vernier readout uses three triplets of electrodes, each triplet consisting of three electrodes whose areas vary sinusoidally and whose phases are each displaced by 120 degrees. The co-ordinate of an event at any point in the active area of the readout is encoded uniquely by the three phases, one phase being generated by each triplet. The Vernier technique uses only the phase information encoded by the electrode areas, whereas previous designs, such as SPAN, also relied on modulation of the sinusoidal amplitude to encode a co-ordinate uniquely. The sensitivity to varying charge footprint size caused by this reliance is thus avoided in the Vernier readout. In addition, fixed pattern noise in the image, resulting from signal digitization prior to phase calculation, is avoided by encoding the final x and y co-ordinates as linear combinations of all three phases. The pattern geometry can be chosen to ensure that the fixed pattern noise in each phase never coincides with that in other phases when combined in the decoding algorithm. We present images and performance data from an MCP based detector using a one Vernier anode, with an active diameter of 25 mm. A first image from the nine electrode two dimensional Vernier anode is shown and its preliminary performance is discussed.

Paper Details

Date Published: 1 September 1995
PDF: 8 pages
Proc. SPIE 2518, EUV, X-Ray, and Gamma-Ray Instrumentation for Astronomy VI, (1 September 1995); doi: 10.1117/12.218387
Show Author Affiliations
Jonathan S. Lapington, Univ. College London (United Kingdom)

Published in SPIE Proceedings Vol. 2518:
EUV, X-Ray, and Gamma-Ray Instrumentation for Astronomy VI
Oswald H. W. Siegmund; John V. Vallerga, Editor(s)

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