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Proceedings Paper

TIS uniformity maps of wafers, disks, and other samples
Author(s): John C. Stover; Marvin L. Bernt; Tod F. Schiff
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Paper Abstract

Total integrated scatter measurements, the earliest well defined measurement relating light scatter to surface roughness, is now being used in modern production facilities as a means of monitoring product surface roughness. The two applications reviewed here are computer disks, where the issue is a well defined roughness (as opposed to the smoothest possible surface) and an emerging issue with roughness specifications for the backsides of silicon wafers. The paper describes a scanning instrument that allows sample uniformity to be revealed and thus the manufacturing process investigated.

Paper Details

Date Published: 1 September 1995
PDF: 5 pages
Proc. SPIE 2541, Optical Scattering in the Optics, Semiconductor, and Computer Disk Industries, (1 September 1995); doi: 10.1117/12.218336
Show Author Affiliations
John C. Stover, The Scatter Works, Inc. (United States)
Marvin L. Bernt, Schmitt Measurement Systems, Inc. (United States)
Tod F. Schiff, Schmitt Measurement Systems, Inc. (United States)

Published in SPIE Proceedings Vol. 2541:
Optical Scattering in the Optics, Semiconductor, and Computer Disk Industries
John C. Stover, Editor(s)

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