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Proceedings Paper

The jet impact force of laser-induced bubble under the water-film with different thickness
Author(s): Beibei Li; Bingyang Wang; Xiumei Liu; Jie He; Jian Lu
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Paper Abstract

The effect of water-film on the laser-induced bubble was investigated by a piezoelectric ceramic transducer (PZT) sensor. Both of the collapse time and liquid-jet impact force of the bubble under the water-film were obtained, and the experiments were also completed in different laser energy. The collapse time increase with the thickness of the waterfilm, but the liquid-jet impact force decrease. We consider that the collapse time was affected by both of the rigid boundary and surface, and the increasing of the collapse time is the reason the decreasing of the liquid-jet impact force. The velocity of bubble wall is lower with the longer collapse time for the uniform bubbles energy, so the liquid-jet impact force is lower. For the other reasons, more laser energy would be absorbed by the thicker water-film, but the water was also splashed for the thinner water-film. So, for the thinner water-film, the bubble energy is higher, the liquidjet impact force is higher, but the maximal radius is smaller because of the splash process. In the other hand, both of the collapse time and the liquid-jet impact force are increase with the laser energy. These researches are useful for the laser processing under water.

Paper Details

Date Published: 4 May 2015
PDF: 6 pages
Proc. SPIE 9543, Third International Symposium on Laser Interaction with Matter, 95430S (4 May 2015); doi: 10.1117/12.2182062
Show Author Affiliations
Beibei Li, China Univ. of Mining and Technology (China)
Bingyang Wang, China Univ. of Mining and Technology (China)
Xiumei Liu, China Univ. of Mining and Technology (China)
Jie He, China Univ. of Mining and Technology (China)
Jian Lu, Nanjing Univ. of Science and Technology (China)

Published in SPIE Proceedings Vol. 9543:
Third International Symposium on Laser Interaction with Matter
Yury M. Andreev; Zunqi Lin; Xiaowu Ni; Xisheng Ye, Editor(s)

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