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Proceedings Paper

Microwave characterization of bicrystal grain boundary junctions
Author(s): Jaroslaw Wosik; Patrick L.-M. Xie; Matthew F. Davis; Nilesh Tralshawala; P. Gierlowski; John H. Miller
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Paper Abstract

We have characterized thin film YBa2Cu3O7-(delta ) (YBCO) bicrystal grain boundary junctions by a non-contact microwave absorption method which is based on the study of dynamic flux quantization in these junctions using the field-modulated-microwave absorption technique. This method is capable of probing the inhomogeneity of coupling in the Josephson junctions. The first derivative of the microwave absorption (dP/dB) as a function of Bdc was measured in a TE102 microwave cavity at 9.5 GHz. Epitaxial films of YBCO were deposited by laser ablation on 24 degree(s) bicrystal substrates of SrTiO(subscript 3$. Lengths of the investigated junctions ranged from 100 micrometers to 2 mm. We observed series of well-resolved absorption lines as a function of externally applied dc magnetic field. The nonuniformity of the grain boundary junction coupling was determined using analysis based on the line profile, the amplitude modulation period and microwave power dependence of the series. A physical model, based on the microwave absorption analysis in a single non-uniform Josephson junction was used for the data interpretation. The results of our measurements agree with a model in which the grain boundary consists of several parallel subjunctions.

Paper Details

Date Published: 1 September 1995
PDF: 9 pages
Proc. SPIE 2559, High-Temperature Microwave Superconductors and Applications, (1 September 1995); doi: 10.1117/12.218170
Show Author Affiliations
Jaroslaw Wosik, Univ. of Houston (United States)
Patrick L.-M. Xie, Univ. of Houston (United States)
Matthew F. Davis, Univ. of Houston (United States)
Nilesh Tralshawala, Univ. of Houston (United States)
P. Gierlowski, Univ. of Houston (Poland)
John H. Miller, Univ. of Houston (United States)


Published in SPIE Proceedings Vol. 2559:
High-Temperature Microwave Superconductors and Applications
James D. Hodge, Editor(s)

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