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Proceedings Paper

Fabrication and surface profile simulation of sapphire microlens array
Author(s): Xiangyang Liu; Shijia Liu; Hui Qiao; Longyuan Zhu; Xiangyang Li
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Paper Abstract

In this paper, photoresist reflow method was used to fabricate microlens array on the sapphire substrate which possesses high mechanical strength and transmittance in broad spectrum. High etch selectivity of sapphire over photoresist was obtained through adjusting ICP etching parameters. To test the fabrication process, a geometric model of square aperture microlens was built by finite element method. The validation of this model was done by comparing the surface profiles of three samples reflowed under different condition with the geometric model. In all three cases the simulation results were close to the experiment results. So the model was justified. On the other hand, the fabrication process was found to be repeatable because the surface profile of fabricated microlens was close to the theoretical surface profile of reflowed photoresist. The geometric model can be used to check the repeatability of photoresist reflow process and to predict the surface profile of microlens with irregular aperture.

Paper Details

Date Published: 13 April 2015
PDF: 7 pages
Proc. SPIE 9522, Selected Papers from Conferences of the Photoelectronic Technology Committee of the Chinese Society of Astronautics 2014, Part II, 95221Q (13 April 2015); doi: 10.1117/12.2180221
Show Author Affiliations
Xiangyang Liu, Shanghai Institute of Technical Physics (China)
Univ. of Chinese Academy of Sciences (China)
Shijia Liu, Shanghai Institute of Technical Physics (China)
Hui Qiao, Shanghai Institute of Technical Physics (China)
Univ. of Chinese Academy of Sciences (China)
Longyuan Zhu, Shanghai Institute of Technical Physics (China)
Xiangyang Li, Shanghai Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 9522:
Selected Papers from Conferences of the Photoelectronic Technology Committee of the Chinese Society of Astronautics 2014, Part II
Xiangwan Du; Jennifer Liu; Dianyuan Fan; Jialing Le; Yueguang Lv; Jianquan Yao; Weimin Bao; Lijun Wang, Editor(s)

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