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Proceedings Paper

Residual internal stress optimization for EPON 828/DEA thermoset resin using fiber Bragg grating sensors
Author(s): Garth D. Rohr; Roger D. Rasberry; Amy K. Kaczmarowski; Mark E. Stavig; Cory S. Gibson; Eric Udd; Allen R. Roach; Brendan Nation
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Paper Abstract

Internal residual stresses and overall mechanical properties of thermoset resins are largely dictated by the curing process. It is well understood that fiber Bragg grating (FBG) sensors can be used to evaluate temperature and cure induced strain while embedded during curing. Herein, is an extension of this work whereby we use FBGs as a probe for minimizing the internal residual stress of an unfilled and filled Epon 828/DEA resin. Variables affecting stress including cure cycle, mold (release), and adhesion promoting additives will be discussed and stress measurements from a strain gauge pop-off test will be used as comparison. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-AC04-94AL85000.

Paper Details

Date Published: 13 May 2015
PDF: 7 pages
Proc. SPIE 9480, Fiber Optic Sensors and Applications XII, 948008 (13 May 2015); doi: 10.1117/12.2179198
Show Author Affiliations
Garth D. Rohr, Sandia National Labs. (United States)
Roger D. Rasberry, Sandia National Labs. (United States)
Amy K. Kaczmarowski, Sandia National Labs. (United States)
Mark E. Stavig, Sandia National Labs. (United States)
Cory S. Gibson, Columbia Gorge Research LLC (United States)
Eric Udd, Columbia Gorge Research LLC (United States)
Allen R. Roach, Sandia National Labs. (United States)
Brendan Nation, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 9480:
Fiber Optic Sensors and Applications XII
Gary Pickrell; Eric Udd; Henry H. Du, Editor(s)

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