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Proceedings Paper

High efficiency blazed fiber-chip grating coupler with interleaved trenches
Author(s): C. Alonso-Ramos; D. Benedikovic; P, Cheben; S, Wang; R, Halir; J. M. Fédéli; A. Ortega-Moñux; J. H. Schmid; D. -X. Xu; M. Dado; I. Molina-Fernández
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Paper Abstract

We demonstrate a fiber-chip surface grating coupler that interleaves standard full and shallow-etched trenches to maximize directionality in the upward direction. The coupler is implemented in a regular SOI substrate with 220 nm silicon thickness and etch depths of 220 nm (full etch) and 70 nm (shallow etch), as offered by silicon photonic foundries. The blazing effect is controlled by adjusting the separation between the two sets of trenches. This way, grating directionality exceeding 95% is achieved independently of the bottom oxide (BOX) thickness. Couplers have been fabricated at LETI using 193 nm DUV lithography on 200 mm SOI wafers with 2 μm BOX. The measured coupling efficiency is -2.1 dB with a 3 dB bandwidth of 52 nm.

Paper Details

Date Published: 1 May 2015
PDF: 7 pages
Proc. SPIE 9516, Integrated Optics: Physics and Simulations II, 95160J (1 May 2015); doi: 10.1117/12.2178620
Show Author Affiliations
C. Alonso-Ramos, Univ. de Málaga (Spain)
Institut d'Électronique Fondamentale, CNRS, Univ. Paris-Sud 11 (France)
D. Benedikovic, Univ. of Žilina (Slovakia)
P, Cheben, National Research Council Canada (Canada)
S, Wang, National Research Council Canada (Canada)
R, Halir, Univ. de Málaga (Spain)
J. M. Fédéli, CEA-LETI (France)
A. Ortega-Moñux, Univ. de Málaga (Spain)
J. H. Schmid, National Research Council Canada (Canada)
D. -X. Xu, National Research Council Canada (Canada)
M. Dado, Univ. of Žilina (Slovakia)
I. Molina-Fernández, Univ. de Málaga (Spain)


Published in SPIE Proceedings Vol. 9516:
Integrated Optics: Physics and Simulations II
Pavel Cheben; Jiří Čtyroký; Iñigo Molina-Fernández, Editor(s)

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