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Proceedings Paper

Solderjet bumping technique used to manufacture a compact and robust green solid-state laser
Author(s): P. Ribes; T. Burkhardt; M. Hornaff; S. Kousar; D. Burkhardt; E. Beckert; M. Gilaberte; D. Guilhot; D. Montes; M. Galan; S. Ferrando; M. Laudisio; T. Belenguer; S. Ibarmia; P. Gallego; J. A. Rodríguez; R. Eberhardt; A. Tünnermann
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Paper Abstract

Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals due to a localized and minimized input of thermal energy. The Solderjet Bumping technique is used to assemble a miniaturized laser resonator in order to obtain higher robustness, wider thermal conductivity performance, higher vacuum and radiation compatibility, and better heat and long term stability compared with identical glued devices. The resulting assembled compact and robust green diode-pumped solid-state laser is part of the future Raman Laser Spectrometer designed for the Exomars European Space Agency (ESA) space mission 2018.

Paper Details

Date Published: 1 June 2015
PDF: 7 pages
Proc. SPIE 9520, Integrated Photonics: Materials, Devices, and Applications III, 952009 (1 June 2015); doi: 10.1117/12.2178373
Show Author Affiliations
P. Ribes, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Friedrich-Schiller-Univ. Jena (Germany)
T. Burkhardt, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
M. Hornaff, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
S. Kousar, Friedrich-Schiller-Univ. Jena (Germany)
D. Burkhardt, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
E. Beckert, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
M. Gilaberte, MONOCROM S.L. (Spain)
D. Guilhot, MONOCROM S.L. (Spain)
D. Montes, MONOCROM S.L. (Spain)
M. Galan, MONOCROM S.L. (Spain)
S. Ferrando, MONOCROM S.L. (Spain)
M. Laudisio, LIDAX (Spain)
T. Belenguer, National Institute of Aerospace Technology INTA (Spain)
S. Ibarmia, National Institute of Aerospace Technology INTA (Spain)
P. Gallego, National Institute of Aerospace Technology INTA (Spain)
J. A. Rodríguez, Engineering Systems for the Defense of Spain ISDEFE (Spain)
R. Eberhardt, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
A. Tünnermann, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Friedrich-Schiller-Univ. Jena (Germany)


Published in SPIE Proceedings Vol. 9520:
Integrated Photonics: Materials, Devices, and Applications III
Jean-Marc Fédéli, Editor(s)

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