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Proceedings Paper

Fabrication of nanowire electronics on nonconventional substrates by water-assisted transfer printing method
Author(s): Chi Hwan Lee; Dong Rip Kim; Xiaolin Zheng
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Paper Abstract

We report a simple, versatile, and wafer-scale water-assisted transfer printing method (WTP) that enables the transfer of nanowire devices onto diverse nonconventional substrates that were not easily accessible before, such as paper, plastics, tapes, glass, polydimethylsiloxane (PDMS), aluminum foil, and ultrathin polymer substrates. The WTP method relies on the phenomenon of water penetrating into the interface between Ni and SiO2. The transfer yield is nearly 100%, and the transferred devices, including NW resistors, diodes, and field effect transistors, maintain their original geometries and electronic properties with high fidelity.

Paper Details

Date Published: 1 June 2015
PDF: 11 pages
Proc. SPIE 9467, Micro- and Nanotechnology Sensors, Systems, and Applications VII, 94670B (1 June 2015); doi: 10.1117/12.2178057
Show Author Affiliations
Chi Hwan Lee, Stanford Univ. (United States)
Dong Rip Kim, Stanford Univ. (United States)
Xiaolin Zheng, Stanford Univ. (United States)


Published in SPIE Proceedings Vol. 9467:
Micro- and Nanotechnology Sensors, Systems, and Applications VII
Thomas George; Achyut K. Dutta; M. Saif Islam, Editor(s)

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