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Proceedings Paper

Data communication through multiple physical media: applications to munitions
Author(s): Harbans S. Dhadwal; Jahangir Rastegar; Dake Feng; Philip Kwok
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Paper Abstract

Electronic systems comprising of subassemblies, distributed across different physical media, require seamless communication between processors and sensors embedded in the disparate volumes. For example, smart munitions systems embed sensors and other key control electronics, throughout the structure, in vastly different physical media. In addition to the obvious space constraints, these structures are subjected to high G forces during launch. Thus, communications through wire harnesses becomes cumbersome, make assembly process and testing difficult, and challenging to make survive high G firing. Here we focus on an approach that takes advantage of the partial optical transparency of epoxy material commonly used in potting electronic components in munitions, as well as the wave guiding that is possible through the body of the munitions wall which is made from composite materials. Experimental results show that a wireless optical link, connecting various parts of the distributed system, is possible at near IR frequencies. Data can be rapidly parsed between a processor, sensors and actuators. We present experimental data for a commercial epoxy system, which is used to embed a number of IrDA devices inside the cone of 120 mm mortar shell. IrDA devices using the FIR data rates establish point-to-point communication through various media, representative of the environment inside the 120 mm mortar cone.

Paper Details

Date Published: 13 May 2015
PDF: 5 pages
Proc. SPIE 9491, Sensors for Extreme Harsh Environments II, 94910K (13 May 2015); doi: 10.1117/12.2177521
Show Author Affiliations
Harbans S. Dhadwal, Omnitek Partners, LLC (United States)
Jahangir Rastegar, Omnitek Partners, LLC (United States)
Dake Feng, Omnitek Partners, LLC (United States)
Philip Kwok, Omnitek Partners, LLC (United States)


Published in SPIE Proceedings Vol. 9491:
Sensors for Extreme Harsh Environments II
Debbie G. Senesky; Sachin Dekate, Editor(s)

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