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Proceedings Paper

Video rate passive millimeter-wave imager utilizing optical upconversion with improved size, weight, and power
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Paper Abstract

In this presentation we will discuss the performance and limitations of our 220 channel video rate passive millimeter wave imaging system based on a distributed aperture with optical upconversion architecture. We will cover our efforts to reduce the cost, size, weight, and power (CSWaP) requirements of our next generation imager. To this end, we have developed custom integrated circuit silicon-germanium (SiGe) low noise amplifiers that have been designed to efficiently couple with our high performance lithium niobate upconversion modules. We have also developed millimeter wave packaging and components in multilayer liquid crystal polymer (LCP) substrates which greatly improve the manufacturability of the upconversion modules. These structures include antennas, substrate integrated waveguides, filters, and substrates for InP and SiGe mmW amplifiers.

Paper Details

Date Published: 19 May 2015
PDF: 8 pages
Proc. SPIE 9462, Passive and Active Millimeter-Wave Imaging XVIII, 946209 (19 May 2015); doi: 10.1117/12.2177133
Show Author Affiliations
Richard D. Martin, Phase Sensitive Innovations, Inc. (United States)
Shouyuan Shi, Univ. of Delaware (United States)
Yifei Zhang, Univ. of Delaware (United States)
Andrew Wright, Univ. of Delaware (United States)
Peng Yao, Phase Sensitive Innovations, Inc. (United States)
Kevin P. Shreve, Univ. of Delaware (United States)
Christopher A. Schuetz, Univ. of Delaware (United States)
Thomas E. Dillon, Phase Sensitive Innovations, Inc. (United States)
Daniel G. Mackrides, Phase Sensitive Innovations, Inc. (United States)
Charles E. Harrity, Phase Sensitive Innovations, Inc. (United States)
Dennis W. Prather, Univ. of Delaware (United States)


Published in SPIE Proceedings Vol. 9462:
Passive and Active Millimeter-Wave Imaging XVIII
David A. Wikner; Arttu R. Luukanen, Editor(s)

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