Share Email Print
cover

Proceedings Paper

Test pixels for high-temperature infrared scene projection
Author(s): Christopher J. Fredricksen; Seth Calhoun; Stephen Trewick; Aubrey Coffey; Edward Dein; Kevin R. Coffey; Robert E. Peale; Joseph D. LaVeigne; Gregory Franks; Tom Danielson; John M. Lannon; Scott H. Goodwin
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

High pixel temperatures for IR scene projector arrays face materials challenges of oxidation, diffusion, and recrystallization. For cost effective development of new high-temperature materials, we have designed and fabricated simplified pixels for testing. These consist of resistive elements, traces, and bond pads sandwiched between dielectric layers on Si wafers. Processing involves a pad exposure etch, a pixel outline etch, and an undercut etch to thermally isolate the resistive element from the substrate. Test pixels were successfully fabricated by electron-beam lithography using a combination of wet and dry etching.

Paper Details

Date Published: 12 May 2015
PDF: 6 pages
Proc. SPIE 9452, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVI, 94520X (12 May 2015); doi: 10.1117/12.2177025
Show Author Affiliations
Christopher J. Fredricksen, LRC Engineering, Inc. (United States)
Seth Calhoun, Univ. of Central Florida (United States)
Stephen Trewick, Univ. of Central Florida (United States)
Aubrey Coffey, Univ. of Central Florida (United States)
Edward Dein, Univ. of Central Florida (United States)
Kevin R. Coffey, Univ. of Central Florida (United States)
Robert E. Peale, Univ. of Central Florida (United States)
Joseph D. LaVeigne, Santa Barbara Infrared, Inc. (United States)
Gregory Franks, Santa Barbara Infrared, Inc. (United States)
Tom Danielson, Santa Barbara Infrared, Inc. (United States)
John M. Lannon, RTI International (United States)
Scott H. Goodwin, RTI International (United States)


Published in SPIE Proceedings Vol. 9452:
Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVI
Gerald C. Holst; Keith A. Krapels, Editor(s)

© SPIE. Terms of Use
Back to Top