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Proceedings Paper

Research on resistance properties of conductive layer materials of microchannel plate film dynode
Author(s): Ling-ling Peng; Qingduo Duanmu; Ji-kai Yang; Guo-zheng Wang
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Paper Abstract

Silicon Microchannel Plate(MCP)is a new image multiplier devices based semiconductor process technology. Compared with the traditional glass MCP, Silicon MCP has an advantage in technology that the dynode materials and the substrate materials are separate. At the same time, the dynode preparation process and the microchannel arrays are also separate. Two different dynode conductive layer films are prepared: polysilicon conductive films prepared by low pressure chemical vapor deposition (LPCVD) and AZO thin films coated by atomic layer deposition (ALD). The conductive films coated by ALD are superior to dynode conductive films prepared by LPCVD. By comparing the resistivity of conductive polysilicon thin film and AZO thin film of different Al concentrations doped, AZO thin film of different Al concentrations doped is a more suitable conductive layer dynode material to satisfy the MCP conductive layer resistivity requirements.

Paper Details

Date Published: 5 March 2015
PDF: 7 pages
Proc. SPIE 9521, Selected Papers from Conferences of the Photoelectronic Technology Committee of the Chinese Society of Astronautics 2014, Part I, 952110 (5 March 2015); doi: 10.1117/12.2175993
Show Author Affiliations
Ling-ling Peng, Changchun Univ. of Science and Technology (China)
Qingduo Duanmu, Changchun Univ. of Science and Technology (China)
Ji-kai Yang, Changchun Univ. of Science and Technology (China)
Guo-zheng Wang, Changchun Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 9521:
Selected Papers from Conferences of the Photoelectronic Technology Committee of the Chinese Society of Astronautics 2014, Part I
Xun Hou; Zhihong Wang; Lingan Wu; Jing Ma, Editor(s)

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