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Proceedings Paper

Optimizing hybrid metrology: rigorous implementation of Bayesian and combined regression
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Paper Abstract

Hybrid metrology, e.g. the combination of several measurement techniques to determine critical dimensions, is an important approach to meet the needs of semiconductor industry. A proper use of hybrid metrology may not only yield more reliable estimates for the quantitative characterization of 3-D structures but also a more realistic estimation of the corresponding uncertainties. Recent developments at the National Institute of Standards and Technology (NIST) feature the combination of optical critical dimension (OCD) measurements and scanning electron microscope (SEM) results. The hybrid methodology offers the potential to make measurements of essential 3-D attributes that may not be otherwise feasible. However, combining techniques gives rise to essential challenges in error analysis and comparing results from different instrument models, especially the effect of systematic and highly correlated errors in the measurement on the ¬χ2 function that is minimized. Both hypothetical examples and measurement data are used to illustrate solutions to these challenges.

Paper Details

Date Published: 19 March 2015
PDF: 10 pages
Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94241J (19 March 2015); doi: 10.1117/12.2175653
Show Author Affiliations
Mark-Alexander Henn, National Institute of Standards and Technology (United States)
Richard M. Silver, National Institute of Standards and Technology (United States)
John S. Villarrubia, National Institute of Standards and Technology (United States)
Nien Fan Zhang, National Institute of Standards and Technology (United States)
Hui Zhou, National Institute of Standards and Technology (United States)
Bryan M. Barnes, National Institute of Standards and Technology (United States)
Bin Ming, National Institute of Standards and Technology (United States)
András E. Vladár, National Institute of Standards and Technology (United States)


Published in SPIE Proceedings Vol. 9424:
Metrology, Inspection, and Process Control for Microlithography XXIX
Jason P. Cain; Martha I. Sanchez, Editor(s)

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