Share Email Print
cover

Proceedings Paper

Photonic-electronic integration with polysilicon photonics in bulk CMOS
Author(s): Rajeev J. Ram
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Here, I review the development of a polysilicon photonic platform that is optimized for integration with electronics fabricated on bulk silicon wafers. This platform enables large-scale monolithic integration of silicon photonics with microelectronics. A single-polysilicon deposition and lithography mask were used to simultaneously define the transistor gate, the low-loss waveguides, the depletion modulators, and the photodetectors. Several approaches to reduce optical scattering and mitigate defect state absorption are presented. Waveguide propagation loss as low as 3 dB/cm could be realized in front-end polysilicon with an end-of-line loss as low as 10 dB/cm at 1280nm. The defect state density could be enhanced to enable all-silicon, infrared photodetectors. The resulting microring resonant detectors exhibit over 20% quantum efficiency with 9.7 GHz bandwidth over a wide range of wavelengths. A complete photonic link has been demonstrated at 5 Gbps that transfers digital information from one bulk CMOS photonics chip to another.

Paper Details

Date Published: 3 April 2015
PDF: 8 pages
Proc. SPIE 9367, Silicon Photonics X, 93670N (3 April 2015); doi: 10.1117/12.2175462
Show Author Affiliations
Rajeev J. Ram, Massachusetts Institute of Technology (United States)


Published in SPIE Proceedings Vol. 9367:
Silicon Photonics X
Graham T. Reed; Michael R. Watts, Editor(s)

© SPIE. Terms of Use
Back to Top