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Proceedings Paper

Observation and analysis of grinding scratch generation around the central part of a component
Author(s): Michimasa Daito; Akira Kanai; Masakazu Miyashita
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Paper Abstract

Ductile mode grinding (DMG) process, which can provide geometric accuracy of 0. 1 tm without cracks on the surface, is highly expected as a next stage machining process of brittle materials. DMG can be achieved when grain depth of cut in uncut chipthickness is controlled to under the ductile-brittle transition value, dc, dc 0. 1 pm for Si wafer'. It is required to develop both ultraprecision grinding machine (2) and truing technology of diamond wheels. In particular ,for realizing ductile mode grinding of brittle materials, the absolute requirement is that the grain depth of cut dg of all active cutting edges has to be smaller than the ductile-brittle transition value, do.. An extruded cutting edge (ECE) from the envelope of adjacent cutting edges causes a serious problem of scratch generation. The present paper deals with observation and analysis of grinding scratch generation around central part of 5, wafers ground with diamond wheels on rotary work-spindle machines.

Paper Details

Date Published: 2 August 1995
PDF: 5 pages
Proc. SPIE 2576, International Conference on Optical Fabrication and Testing, (2 August 1995); doi: 10.1117/12.215616
Show Author Affiliations
Michimasa Daito, Nissin Machine Works, Ltd. (Japan)
Akira Kanai, Ashikaga Institute of Technology (Japan)
Masakazu Miyashita, Ashikaga Institute of Technology (Japan)


Published in SPIE Proceedings Vol. 2576:
International Conference on Optical Fabrication and Testing
Toshio Kasai, Editor(s)

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