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Proceedings Paper

Sizing the next generation of optical photomasks
Author(s): Gilbert V. Shelden; Anne Rudack; Rajeev R. Singh; Wayne Smith; Alvina M. Williams
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Paper Abstract

Photomask technology remains one of the key enablers for the advancement of the semiconductor industry. Optical lithography will continue to be the mainstream technology for 0.25 micrometers and will likely extend below 0.2 micrometers . Continuous improvements in all aspects of fabrication will be required to support the ever decreasing error budgets as critical images continue to shrink. Additionally, stepper manufacturers will be migrating to large print fields via the use of advanced techniques like step and scan. The size of these print fields becomes limited, not by the size of the lens, but by the size of the photomask. For the photomask industry to cost-effectively implement the next reticle size, standardization will be required. Sufficient volume of production and higher process will be necessary to recover the high implementation costs.

Paper Details

Date Published: 3 July 1995
PDF: 6 pages
Proc. SPIE 2512, Photomask and X-Ray Mask Technology II, (3 July 1995); doi: 10.1117/12.212801
Show Author Affiliations
Gilbert V. Shelden, SEMATECH (United States)
Anne Rudack, SEMATECH (United States)
Rajeev R. Singh, SEMATECH (United States)
Wayne Smith, SEMATECH (United States)
Alvina M. Williams, SEMATECH (United States)


Published in SPIE Proceedings Vol. 2512:
Photomask and X-Ray Mask Technology II
Hideo Yoshihara, Editor(s)

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