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Proceedings Paper

Printability of laser mask repairs at deep UV
Author(s): James A. Reynolds; Franklin M. Schellenberg
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Paper Abstract

Over 50% of today's 5X reticles require some sort of repair to meet the zero defect criteria. A successful repair must remove materials so the aerial image of the defective site is identical to that of a nondefective site within the tolerance required by the printing process. Shorter printing wavelengths increase sensitivity to surface roughness and deposited film. In this study, two different laser repair techniques were used to remove selected defects from a standard KLA defect printability reticle and the reticle was printed onto wafers at 248 nm. An atomic force microscope (AFM), aerial image measurement system (AIMS) and scanning electron microscope (SEM) were used to evaluate the reticle and wafer sites.

Paper Details

Date Published: 3 July 1995
PDF: 12 pages
Proc. SPIE 2512, Photomask and X-Ray Mask Technology II, (3 July 1995); doi: 10.1117/12.212794
Show Author Affiliations
James A. Reynolds, Reynolds Consulting (United States)
Franklin M. Schellenberg, Hewlett-Packard Labs. (United States)


Published in SPIE Proceedings Vol. 2512:
Photomask and X-Ray Mask Technology II
Hideo Yoshihara, Editor(s)

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