Share Email Print
cover

Proceedings Paper

Yield enhancement through identifying design sensitivities
Author(s): Bei Tseng Bill Chu; Mark D. Kellam
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published: 1 January 1990
PDF: 8 pages
Proc. SPIE 1293, Applications of Artificial Intelligence VIII, (1 January 1990); doi: 10.1117/12.21150
Show Author Affiliations
Bei Tseng Bill Chu, Univ. of North Carolina/Charlotte (United States)
Mark D. Kellam, Microelectronics Ctr. of North Carolina (United States)


Published in SPIE Proceedings Vol. 1293:
Applications of Artificial Intelligence VIII
Mohan M. Trivedi, Editor(s)

© SPIE. Terms of Use
Back to Top